Qualcomm QCC-3072 Bluetooth Audio IC

Qualcomm® QCC3072 is designed for the future of wireless sound, with support for LE Audio use cases and 24-bit 96kHz high res music streaming with Snapdragon Sound™ technology – our optimized chain of superior audio, connectivity, and mobile innovations.

This dual-mode platform brings LE Audio use cases for audio sharing, gaming and stereo recording supported alongside traditional Bluetooth tech, for the best listening experiences in a wide range of environments.

Part no.: QCC-3072

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Key features

Extremely low-power performance
Designed to support Bluetooth LE Audio use cases
Bluetooth 5.3 radio
Ultra-small form factor
Powerful tri-core processor architecture – supporting complex use cases
Dual core 32-bit processor application subsystem (up to 80MHz)
Single core 180 Mhz configurable Qualcomm® Kalimba™ DSP audio subsystem (runs from ROM)
Qualcomm TrueWireless™ Mirroring technology for improved robustness and a superior user experience
Designed to support button activated digital assistants including Amazon Alexa Voice Service and Google Assistant
Support for Google Fast Pair
Software architecture compatible with Qualcomm® QCC302x, Qualcomm® QCC304x, Qualcomm® QCC304x and Qualcomm® QCC305x series
Embedded ROM + RAM and external Q-SPI Flash
On-chip memory for audio buffering
High-performance audio combined with low-power consumption
Support for aptX Voice superior for call quality on uplink and downlink
Support for 24bit/96kHz high resolution audio
Support for aptX Audio including aptX Adaptive cVc
24-bit audio interfaces
Support for Qualcomm Hybrid ANC - feedforward, feedback, hybrid and adaptive

Applications

Smart Home
Consumer Electronics

Industries

Consumer Electronics

Qualcomm wireless module QCC3072 bluetooth audio

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