High-Definition, Cost-Effective and Compact Thermal Imaging Camera Module Powered by SenXorTM, Meridian Innovation’s patented innovative CMOS hybrid architecture, MI0801 Camera Module is a Wafer Level Vacuum Packaged (WLVP) 80 x 62 Long
Wavelength Infrared (LWIR) thermal array sensor from Meridian
Innovation mounted in a custom housing.
The MI0801 chip comprises of two CMOS wafers bonded together with a vacuum cavity in between. The base (active) wafer contains all the circuit and sensor elements; the top (cap) wafer is required to transfer the LWIR radiation and maintain a vacuum environment for optimum operation of the LWIR detectors.
The MI0801 Camera Module comprises of WLVP chip, die attached to a PCB substrate and mounted in a custom housing, including lens assembly. It is designed to connect to Meridian Innovation’s MI48A0 Thermal Image Processor Board via a simple flat strip cable. In this way multiple processing subsystems can be supported. The housing allows for the fitment of various lens assemblies, allowing fast adaptation within several application areas.