Key features

  • Package : Ceramic package
  • Dimension : 1.50 mm x 1.90 mm
  • Chip Technology : Thin GaN
  • ESD : 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
  • Qualifications : AEC-Q102 Qualified with RV-level 1

Applications

  • Automotive