The Qualcomm RB3 Gen 2 development kit gives developers a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.

Utilizing the Qualcomm® QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased performance compared to the previous generation, including increased AI processing, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously.

The Qualcomm RB3 Gen 2 Lite Vision Kit gives developers a valuable combination of impressive performance and customizable features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.

The Qualcomm RB3 Gen 2 Lite is based on the Qualcomm® QCS5430 processor.

The Qualcomm RB3 Gen 2 Lite Core Kit gives developers a valuable combination of impressive performance and customizable features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.

The Qualcomm RB3 Gen 2 Lite is based on the Qualcomm® QCS5430 processor.

The QCM2290/QCS2290 enable reliable
performance and power-conservation with
LTE connectivity, upgraded features and
memory support for low power consumption.
Equipped with the Cortex A53 quad-core
CPU architecture, the entry-level platform is
a cost-effective solution, delivering greater
performance, higher graphics capabilities,
better quality images, and improved
power performance compared to previous
generations. This platform is well-suited
for retail point-of-sale (POS), industrial
handheld, tracking and camera applications.

The IPQ4018 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines dual-band 11ac, advanced Wi-Fi features and network processing in a variety of configurations for high-performance, power-efficient and cost-effective network infrastructure products.

The IPQ4019 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines dual-band 11ac, advanced Wi-Fi features and network processing in a variety of configurations for high-performance, power-efficient and cost-effective network infrastructure products.

Indeed the IPQ4029 is the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. In particular, highly-integrated, single-chip design combines dual-band 11ac, advanced Wi-Fi features and network processing in a variety of configurations for high-performance, power-efficient and cost-effective network infrastructure products.

The IPQ8068 is a quad-core network processor designed to bring unprecedented performance, scalability and power efficiency to enterprise and carrier network equipment. It combines a powerful, dual-core Qualcomm® Krait™ CPU (1.4 GHz) for control plane and applications, with a dual-core 730 MHz Network Subsystem (NSS) to accelerate packet processing. The 28nm design enables full-performance 802.11ac access points on existing Power over Ethernet (PoE), while the integrated security engine supports Unified Threat Management systems without impacting system performance.

It communicates using the 802.11ad protocol over an IF signal at 15 GHz. The QCA6335 chipset when combined with the QCA6310 chipset can communicate over the 60 GHz unlicensed frequency band at speeds of 4.6 Gbps using a single carrier transmission.

Includes dedicated ground pins for improved grounding, mechanical strength, and thermal continuity and employs DAC/ADC, BB amplification and filtering, and conversion from IQ modulation to IF signaling at 15 GHz. Supports single carrier modulation from BPSK up to 16 QAM and implements the IEEE 802.11ad-2012 MAC protocol. Also, supports immediate BA exchange protocol on top of implementing reverse direction.

Wi-Fi 6 and Bluetooth 5.1 in an integrated SoC designed to exceed industry standards and deliver breakthrough performance for mobile and computing devices.
The Qualcomm® FastConnect™ 6800 Mobile Connectivity Subsystem is an advanced 14nm 2×2 Mobile Connectivity SoC supporting Wi-Fi 6 and Bluetooth 5.1 features for mobile and computing devices.

Built to meet the surging connectivity demands of today’s world, the FastConnect 6800 subsystem is designed to deliver faster, more secure, and more robust Wi-Fi experiences and enable new Bluetooth audio capabilities such as ultra-high-definition voice and low-latency gaming over wireless headphones, earbuds, and speakers.

High-quality 2×2 Wi-Fi and Bluetooth 5.0 performance in an integrated, automotive connectivity SoC.   The Qualcomm® QCA6574AU System-on-Chip (SoC) is a high value automotive connectivity SoC with proven 2×2 802.11ac and Bluetooth 5.0 technology.

Built to offer an impressive connectivity experience consistent with mainstream automotive use cases, QCA6574AU is equipped with 2×2 MIMO capability designed to deliver fast, secure, and robust Wi-Fi experiences. It also facilitates Bluetooth audio capabilities for voice, music, and gaming.

High-quality 2×2 Wi-Fi and Bluetooth 5.0 performance in an integrated, automotive connectivity SoC.   The Qualcomm® QCA6574AU System-on-Chip (SoC) is a high value automotive connectivity SoC with proven 2×2 802.11ac and Bluetooth 5.0 technology.

Built to offer an impressive connectivity experience consistent with mainstream automotive use cases, QCA6574AU is equipped with 2×2 MIMO capability designed to deliver fast, secure, and robust Wi-Fi experiences. It also facilitates Bluetooth audio capabilities for voice, music, and gaming.

Wave-2 802.11ac SoC for Routers, Gateways and Access Points
The IPQ4019 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines dual-band 11ac, advanced Wi-Fi features and network processing in a variety of configurations for high-performance, power-efficient and cost-effective network infrastructure products.

The Qualcomm Atheros QCA9880 s a highly integrated wireless local area network (WLAN) system-on-chip (SoC) for 5 GHz 802.11ac or 2.4/5 GHz 802.11n WLAN applications. The QCA9880 integrates an on-board CPU for low-level setup of WLAN physical layer (PHY) and RF to offload the host processor for other tasks. It enables high-performance 3×3 MIMO with three spatial streams for wireless applications demanding the highest robust link quality and maximum throughput and range. The QCA9880 integrates a multi-protocol MAC, PHY, analog-to-digital/digital-to-analog converters (ADC/DAC), 3×3 MIMO radio transceivers, and PCI Express interface in an all-CMOS device for low power consumption and small form-factor applications.

The QCA9880 implements half-duplex OFDM, CCK, and DSSS PHY, supporting 1.3 GBps for 802.11ac 80 MHz channel operation. It supports 802.11n up to 216.7 Mbps for 20 MHz and 450 Mbps for 40 MHz channel operations, and IEEE 802.11a/b/g data rates. Additional features include Maximal Likelihood (ML) decoding, Low-Density Parity Check (LDPC), Maximal Ratio Combining (MRC), Space Time Block Code (STBC), and On-Chip One-Time Programmable (OTP) memory to eliminate the need for an external flash and to further reduce the external component count and BOM cost. The QCA9880 supports 802.11 wireless MAC protocol, 802.11i security, Rx/Tx filtering, error recovery, and 802.11e quality of service (QoS).

The Qualcomm Atheros QCA9880 s a highly integrated wireless local area network (WLAN) system-on-chip (SoC) for 5 GHz 802.11ac or 2.4/5 GHz 802.11n WLAN applications. The QCA9880 integrates an on-board CPU for low-level setup of WLAN physical layer (PHY) and RF to offload the host processor for other tasks. It enables high-performance 3×3 MIMO with three spatial streams for wireless applications demanding the highest robust link quality and maximum throughput and range. The QCA9880 integrates a multi-protocol MAC, PHY, analog-to-digital/digital-to-analog converters (ADC/DAC), 3×3 MIMO radio transceivers, and PCI Express interface in an all-CMOS device for low power consumption and small form-factor applications.

The QCA9880 implements half-duplex OFDM, CCK, and DSSS PHY, supporting 1.3 GBps for 802.11ac 80 MHz channel operation. It supports 802.11n up to 216.7 Mbps for 20 MHz and 450 Mbps for 40 MHz channel operations, and IEEE 802.11a/b/g data rates. Additional features include Maximal Likelihood (ML) decoding, Low-Density Parity Check (LDPC), Maximal Ratio Combining (MRC), Space Time Block Code (STBC), and On-Chip One-Time Programmable (OTP) memory to eliminate the need for an external flash and to further reduce the external component count and BOM cost. The QCA9880 supports 802.11 wireless MAC protocol, 802.11i security, Rx/Tx filtering, error recovery, and 802.11e quality of service (QoS).

The Qualcomm Atheros QCA9880 s a highly integrated wireless local area network (WLAN) system-on-chip (SoC) for 5 GHz 802.11ac or 2.4/5 GHz 802.11n WLAN applications. The QCA9880 integrates an on-board CPU for low-level setup of WLAN physical layer (PHY) and RF to offload the host processor for other tasks. It enables high-performance 3×3 MIMO with three spatial streams for wireless applications demanding the highest robust link quality and maximum throughput and range. The QCA9880 integrates a multi-protocol MAC, PHY, analog-to-digital/digital-to-analog converters (ADC/DAC), 3×3 MIMO radio transceivers, and PCI Express interface in an all-CMOS device for low power consumption and small form-factor applications.

The QCA9880 implements half-duplex OFDM, CCK, and DSSS PHY, supporting 1.3 GBps for 802.11ac 80 MHz channel operation. It supports 802.11n up to 216.7 Mbps for 20 MHz and 450 Mbps for 40 MHz channel operations, and IEEE 802.11a/b/g data rates. Additional features include Maximal Likelihood (ML) decoding, Low-Density Parity Check (LDPC), Maximal Ratio Combining (MRC), Space Time Block Code (STBC), and On-Chip One-Time Programmable (OTP) memory to eliminate the need for an external flash and to further reduce the external component count and BOM cost. The QCA9880 supports 802.11 wireless MAC protocol, 802.11i security, Rx/Tx filtering, error recovery, and 802.11e quality of service (QoS).

The Qualcomm Atheros QCA9880 s a highly integrated wireless local area network (WLAN) system-on-chip (SoC) for 5 GHz 802.11ac or 2.4/5 GHz 802.11n WLAN applications. The QCA9880 integrates an on-board CPU for low-level setup of WLAN physical layer (PHY) and RF to offload the host processor for other tasks. It enables high-performance 3×3 MIMO with three spatial streams for wireless applications demanding the highest robust link quality and maximum throughput and range. The QCA9880 integrates a multi-protocol MAC, PHY, analog-to-digital/digital-to-analog converters (ADC/DAC), 3×3 MIMO radio transceivers, and PCI Express interface in an all-CMOS device for low power consumption and small form-factor applications.

The QCA9880 implements half-duplex OFDM, CCK, and DSSS PHY, supporting 1.3 GBps for 802.11ac 80 MHz channel operation. It supports 802.11n up to 216.7 Mbps for 20 MHz and 450 Mbps for 40 MHz channel operations, and IEEE 802.11a/b/g data rates. Additional features include Maximal Likelihood (ML) decoding, Low-Density Parity Check (LDPC), Maximal Ratio Combining (MRC), Space Time Block Code (STBC), and On-Chip One-Time Programmable (OTP) memory to eliminate the need for an external flash and to further reduce the external component count and BOM cost. The QCA9880 supports 802.11 wireless MAC protocol, 802.11i security, Rx/Tx filtering, error recovery, and 802.11e quality of service (QoS).

The Qualcomm Atheros QCA9880 s a highly integrated wireless local area network (WLAN) system-on-chip (SoC) for 5 GHz 802.11ac or 2.4/5 GHz 802.11n WLAN applications. The QCA9880 integrates an on-board CPU for low-level setup of WLAN physical layer (PHY) and RF to offload the host processor for other tasks. It enables high-performance 3×3 MIMO with three spatial streams for wireless applications demanding the highest robust link quality and maximum throughput and range. The QCA9880 integrates a multi-protocol MAC, PHY, analog-to-digital/digital-to-analog converters (ADC/DAC), 3×3 MIMO radio transceivers, and PCI Express interface in an all-CMOS device for low power consumption and small form-factor applications.

The QCA9880 implements half-duplex OFDM, CCK, and DSSS PHY, supporting 1.3 GBps for 802.11ac 80 MHz channel operation. It supports 802.11n up to 216.7 Mbps for 20 MHz and 450 Mbps for 40 MHz channel operations, and IEEE 802.11a/b/g data rates. Additional features include Maximal Likelihood (ML) decoding, Low-Density Parity Check (LDPC), Maximal Ratio Combining (MRC), Space Time Block Code (STBC), and On-Chip One-Time Programmable (OTP) memory to eliminate the need for an external flash and to further reduce the external component count and BOM cost. The QCA9880 supports 802.11 wireless MAC protocol, 802.11i security, Rx/Tx filtering, error recovery, and 802.11e quality of service (QoS).

The Qualcomm Robotics RB5 Platform supports the development of next generation of high-compute, AI-enabled, low power robots and drones for the consumer, enterprise, defense, industrial and professional service sectors that can be connected by 5G.

The platform’s Qualcomm QRB5165 processor, customized for robotics applications, offers a powerful heterogeneous computing architecture coupled with the leading 5th generation Qualcomm® Artificial Intelligence (AI) Engine delivering 15 Trillion Operations Per Second (TOPS) of AI performance to efficiently run complex AI and deep learning workloads and on-device edge inferencing while using lower power , on device machine learning, and accurate edge inferencing. The processor also offers a powerful image signal processor (ISP) with support for seven concurrent cameras, a dedicated computer vision engine for enhanced video analytics (EVA), as well as the new Qualcomm® Hexagon™ Tensor Accelerator (HTA). With support for 4G and 5G connectivity speeds via a companion module, the Qualcomm Robotics RB5 platform helps pave the way for the proliferation of 5G in robotics and intelligent systems.

The QCS8250 System-on-Chip (SoC) brings the latest technologies in a highly integrated chipset that delivers maximum performance with exceptional features. This chip is purpose-built for enterprise and commercial IoT applications such as video collaboration, smart camera, connected healthcare, smart retail and more.
The QCS8250 offers a powerful heterogeneous computing architecture coupled with the Qualcomm® AI Engine to efficiently run complex AI and deep learning workloads and on-device edge inferencing at incredibly low power.

The Qualcomm® QCS610 SoC is a high performance IoT System-on-Chip (SoCs) delivering premium features for building advanced smart camera and IoT use cases encompassing machine learning, edge computing, sensor processing, voice UI enablement and integrated wireless connectivity cost effectively.

The QCS610 SoC is engineered to deliver powerful computing for on-device camera processing and machine learning, with exceptional power and thermal efficiency, across a wide range of IoT applications. It integrates a powerful image signal processor (ISP) and the Qualcomm® Artificial Intelligence (AI) Engine, along with a heterogeneous compute architecture including highly optimized custom CPU, GPU and DSP for accelerated AI performance.

The Qualcomm® QCS410 SoC is a high performance IoT System-on-Chip (SoCs) delivering premium features for building advanced smart camera and IoT use cases encompassing machine learning, edge computing, sensor processing, voice UI enablement and integrated wireless connectivity cost effectively.

The QCS410 SoC is engineered to deliver powerful computing for on-device camera processing and machine learning, with exceptional power and thermal efficiency, across a wide range of IoT applications. It integrates a powerful image signal processor (ISP) and the Qualcomm® Artificial Intelligence (AI) Engine, along with a heterogeneous compute architecture including highly optimized custom CPU, GPU and DSP for accelerated AI performance.

The Qualcomm QCS400 series of audio System-on-Chips (SoCs) are designed to bring a wealth of new capabilities and smart functionality to our audio portfolio and help deliver the new consumer experiences driving the voice-controlled home audio ecosystem.

These advanced SoCs are based on our high-performance, low-power architecture, with dual DSPs, our Qualcomm® Artificial Intelligence (AI) Engine and superior connectivity. They are designed to deliver this unique and extremely rich feature-set at our highest level of integration yet – thereby helping significantly reduce overall BOM for complex, feature rich, voice-supported home audio products at a range of tiers.

The QCS400 series SoCs are designed for innovation with flexibility across various levels of processing power, scalable connectivity options and machine learning capabilities that product developers can use to generate new and customized experiences.

The Qualcomm QCS400 series of audio System-on-Chips (SoCs) are designed to bring a wealth of new capabilities and smart functionality to our audio portfolio and help deliver the new consumer experiences driving the voice-controlled home audio ecosystem.

These advanced SoCs are based on our high-performance, low-power architecture, with dual DSPs, our Qualcomm® Artificial Intelligence (AI) Engine and superior connectivity. They are designed to deliver this unique and extremely rich feature-set at our highest level of integration yet – thereby helping significantly reduce overall BOM for complex, feature rich, voice-supported home audio products at a range of tiers.

The QCS400 series SoCs are designed for innovation with flexibility across various levels of processing power, scalable connectivity options and machine learning capabilities that product developers can use to generate new and customized experiences.

Designed specifically for smart assistants, small form factor smart speakers and audio-capable home hub applications with an integrated, advanced Voice UI.
The Qualcomm® QCS403 System-on-Chip (SoC) is designed to bring new capabilities and smart functionality to lower-tier smart speakers and smart assistants.

QCS403 is part of our Qualcomm® QCS400 series of dedicated audio SoCs based on our high performance, low-power architecture. This SoC is designed to significantly reduce overall BOM for feature rich, voice-supported home audio products at a lower consumer price point.

Qualcomm® QCC5171 is designed for the future of wireless sound, with support for LE Audio use cases and CD-Lossless (16-bit 44.1kHz) audio with Snapdragon Sound™ technology – our optimized chain of superior audio, connectivity, and mobile innovations.

Integrated features include our third generation Qualcomm® Adaptive Active Noise Cancellation (ANC), with full-band ambient mode for strong, effective noise cancellation and a natural feeling of spatial awareness.

Qualcomm® QCC5151 is a premium tier, ultra-low power, single-chip solution with a programmable DSP, optimized for use in truly wireless earbuds and hearables. QCC5151 is designed to elevate the truly wireless consumer experience with comprehensive support for our audio technologies, robust connectivity, superior battery life and enhanced ear comfort.

Integrated features include Qualcomm® Adaptive Active Noise Cancellation (ANC), voice assistant support (including always-on wake-word activation), Qualcomm® aptX™ Adaptive audio and Qualcomm TrueWireless™ Mirroring technology.

Qualcomm® QCC5144 is optimized for use in earbuds and hearables, this premium tier single-chip solution is designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* and comfort, integrated Qualcomm® Active Noise Cancellation technology (ANC), Voice Assistant support (including wake-word activation), and Qualcomm TrueWireless™ Mirroring technology, delivering premium wireless audio quality including support for Qualcomm® aptX™ Adaptive audio.

Extremely low-power premium tier Bluetooth Audio SoC in a WLCSP package, designed for use in compact, voice-enabled, feature rich, truly wireless earbuds.

Qualcomm® QCC5141 is optimized for use in earbuds and hearables, this premium tier single-chip solution is designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* and comfort, integrated Qualcomm® Active Noise Cancellation technology (ANC), Voice Assistant support (including wake-word activation), and Qualcomm TrueWireless™ Mirroring technology, delivering premium wireless audio quality including support for Qualcomm® aptX™ Adaptive audio.

Extremely low power premium tier Bluetooth Audio SoC in a BGA package, designed for use in compact, voice enabled, feature rich wire-free earbuds, hearables and headsets.

The Qualcomm® QCC5127 System-on-Chip (SoC) is designed to meet consumer demand for robust, high quality, wireless Bluetooth listening experiences with support for voice assistants. The SoC is optimized for small form-factor devices to support extremely low power consumption for longer audio playback.

Qualcomm® QCC3072 is designed for the future of wireless sound, with support for LE Audio use cases and 24-bit 96kHz high res music streaming with Snapdragon Sound™ technology – our optimized chain of superior audio, connectivity, and mobile innovations.

This dual-mode platform brings LE Audio use cases for audio sharing, gaming and stereo recording supported alongside traditional Bluetooth tech, for the best listening experiences in a wide range of environments.

Qualcomm® QCC3071 is designed for the future of wireless sound, with support for LE Audio use cases and CD-Lossless (16-bit 44.1kHz) audio with Snapdragon Sound™ technology – our optimized chain of superior audio, connectivity, and mobile innovations.

This dual-mode platform brings LE Audio use cases for audio sharing, gaming and stereo recording supported alongside traditional Bluetooth tech, for the best listening experiences in a wide range of environments.

Qualcomm® QCC3056 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and hearables. QCC3056 is designed specifically to help manufacturers to differentiate at a range of tiers by bringing our quad-core architecture and supporting our premium audio technologies in the very fast-moving, price-sensitive truly wireless earbud category.

Qualcomm® QCC3044 is an entry-level flash programmable Bluetooth Audio SoC based on an extremely low power architecture which has been designed for use in Bluetooth Stereo Headsets and Headphones and supports Qualcomm aptX™, aptX HD and aptX Adaptive, and Qualcomm® Active Noise Cancellation (ANC). The QCC3044 is available in a VFBGA package and is designed to provide our customers with a solution that helps to reduce development time and cost.

Qualcomm® QCCC3034 is an entry-level flash programmable Bluetooth Audio SoC based on an extremely low power architecture which has been designed for use in Bluetooth Stereo Headsets and supports Qualcomm aptX™ and aptX HD. The QCC3034 is available in a VFBGA package and is designed to provide our customers with a solution that helps to reduce development time and cost.

QCC3031 is an entry-level flash programmable Bluetooth Audio SoC based on an extremely low power architecture which has been designed for use in featured optimized Bluetooth speakers.

The QCC3031 is available in a QFN package with support for Qualcomm® aptX™ and aptX HD audio, and is designed to provide our customers with a solution that helps to reduce development time and cost.

QCCC3021 is an entry-level flash programmable Bluetooth Audio SoC based on an ultra-low power architecture which has been designed for use in featured optimized Bluetooth speakers.

The QCC3021 is available in a QFN package and is designed to provide our customers with a solution that helps to reduce development time and cost.

High performance 2×2 dual-band 802.11ac Wi-Fi with MU-MIMO and Bluetooth 5.0 radios in a single-chip solution.  Designed to deliver a cost-effective Wi-Fi/Bluetooth combo solution, the Qualcomm® QCA6174A SoC (System-on-Chip) is an integrated, single-chip solution in a small form factor for mobile and consumer electronics applications.

QCA6174A supports high-speed Wi-Fi connectivity and enriched media experiences. It is optimized for energy efficiency, which is critical to extending the battery life of portable devices.

QCA6174A has integrated RF front-end and single-ended design for simpler and low-cost design.

The QCA4531 is a two stream (2×2) 802.11b/g/n single-band programmable Wi-Fi System-on-Chip (SoC) for the Internet of Things (IoT). This low-cost turnkey solution combines high performance connectivity capabilities with a user-programmable Linux OpenWrt environment and is designed to serve either as a feature-rich IoT node or as a hub to support an IoT ecosystem.